BA/BS in Electronic Packaging Technology

Electronic Packaging Technology, offered with an integrated circuit manufacturing emphasis, is an engineering bachelor programme at Shanghai Dianji University. It is a priority school-level specialty linked to the semiconductor cluster around the Lingang area and aims to produce practical field engineers. The curriculum covers chip fabrication processes, packaging materials and structures, advanced packaging processes and equipment, micro-interconnection and device reliability with failure analysis. A particular strand addresses high-reliability integrated circuit manufacturing and precision packaging for aerospace. Foundation courses include electrical technology, engineering mechanics, semiconductor physics, materials science and microelectronics, and practice components include workplace internships and a graduation project. Graduates are suited to integrated circuit, aerospace electronics, vehicle electronics and medical equipment sectors, in roles such as process development, structural design, failure analysis, equipment maintenance and quality control.